RISHO KOGYO CO., LTD.

Mounting points of RISHOLITE thermal solution materials

Proposal of applications of RISHO thermal solution materials

Brief explanation

Aluminum base PWB material composed with Insulation resin layer covered with Copper foil.

Two types of Insulating layer ,"Resin type" and "Prepreg type", are available.

We are recommending as heat dissipation substrate of Power LEDs or Power devices.

Solder crack resistant type with soft insulation layer in order to absorb thermal expansion of Aluminum plate is also available.

CCL for LED subsrate with excellent Anti discoloration property by UV and Heat.

High thermal conductive CCL

Glass/Epoxy CCL with Excellent thermal conductivity of 3.0W/mK.

As consisting of only glass fabric ,thin substrate up to 0.06mm can be laminated.

This thinness can make thermal resistance low and heat of power devices can be dissipated efficiently.

High thermal conductive Bonding sheet

Bonding material for making LED or Power device substrate with heat dissipation property.

Excellent in both Thermal conductivity and Insulating property.

Low resin flow type or Anti dicoloration type are also available.

High thermal conductive prepreg

Excellent in thermal conductivity of 3.0W/mK in spite of consisting of glass fabric.

And also available for multilayer processing.

With using this prepreg as bonding sheet,thermal solutions of PWB can be realized easily.

Resin Coated Copper

Copper foil coated with insulating adhesive.With using this RCC, thermal substrate can be made easily

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