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Electronic material

Halogen-free Dust-free Low flow prepreg ES-3345

For FPC interlayer component as well as adhesive

Excellent in Low resin dust property as well as Low resin flow property

Can be used as FPC construction material ,as well as adhesive

▼Cross section cut by hard blade /SEM photo(Material thickness:0.06mm)
ES-3345 has neither resin dust nor glass fabric exposure
General property
Test item Unit ES-3345
40μm 60μm 100μm
Halogen content - No No No
Glass cloth
(IPC standard)
- 1027 1078 2116
Base resin - Epoxy Epoxy Epoxy
Resin content % 64 52 45
Finished thickness μm 38 62 109
Resin flow % 2.1 2.8 2.7
Resin volatility % 1.4 1.2 0.8
Tg(TMA) 165 165 167
CTE in thickness direction α1 ppm/℃ 64 63 61
α2 325 310 285
Thermal expansion(30→125℃) % 0.62 0.61 0.67
Solder limit
(260℃ Float)
sec. >300 >300 >300
Peel strength 18μm Cu N/mm 1.0 1.3 1.4
PI(Gloss surface) - Broken Broken
Insulating
resistance
C-96/20/65 6.8×108 1.8×108 1.6×108
+D-2/100 1.6×108 1.2×108 1.0×108
Surface
resistance
C-96/20/65 3.9×108 4.2×108 1.8×109
+C-96/40/90 2.7×107 2.3×108 1.1×109
Volume
resistivity
C-96/20/65 MΩ・m 4.5×108 2.6×107 1.6×107
+C-96/40/90 1.5×108 1.3×107 9.9×106
UL flame class - VTM-0 equiv. VTM-0 equiv. VTM-0 equiv.