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Electronic material

High Tg Glass/Epoxy Tape


From the left： Processed product into Smart card terminal, Copper clad type,unclad type.

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RISHO high Tg Glass/Epoxy tape is film-like PWB material for semiconductor direct bonding application(TAB).
Many used as Smart card's terminal substrate for various use such as Banker's card ,Credit card,Health insurance card and so on.

 

Other applications

 

Properties

  • Excellent in wire-bonding workability with excellent hot hardness.
  • Excellent in adhesion to copper foil or to adhesive agent
  • Excellent in insulation resistance.
  • Excellent in chemical resistance
  • Low temp. curable (Max.160℃ )
  • Compared with PI film,Excellent in demensional stability with proper stiffness
Applications

 

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General properties(Representative product)

Test items Product code Black G-10 Test method

ES-3524(Black) / CS-3524(Yellow)

ES-3523(Black) / CS-3523(Yellow)
Thickness (μm)
 70 120 -
Color A Black or Yellow -
Water absorption(%) E-24/50
+D-24/20		 1.0 1.0 JIS K-6911

Dimensional change

(%)
E-24/50
+D-24/20
 Warp 0.03 0.03 JIS C-2318
Fill
 0.04 0.04
E-24/50
+C-24/40/90
Warp
 0.02 0.02
Fill
 0.03 0.03
E-24/50
+E-1/150
Warp
 -0.04 -0.04
Fill
 -0.05 -0.05
Tensile strength
(MPa)		 A
Warp
 210 280
Fill
 130 170

Tensile elongation

(%)

 A
Warp
 1.6 2.2
Fill
 0.8 1.1

Surface resistance

(MΩ)

 C-96/20/65 108～107 106～107 JIS K-6911
C-96/20/65+D-2/100 104～105 104～105
Volume resistivity
(MΩm)		 C-96/20/65 106～107 106～107
C-96/20/65+D-2/100 105～106 105～106
Dielectric breakdown
(kV/0.1mm)		 A 3.3 3.3
Tg (℃) - 150 150 DSC
UL flammability A,E-168/70 - - UL
Chemical resistance
 (1)TCE×5min. boiling
(2)ACETONE×30min. dipping
(3)10% HCl&10%KCN&10%NaOH 50℃×15min. dipping		 OK -