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HOME > Products > Electronic material > FPC stiffener > Halogen-free film type

Electronic material

Black colord stiffener (Under development)

black stiffener

 

RISHO's proposal

Black colored type for Visual effect,Inspection visibility,Hiding of circuit pattern,Light shielding or Prevention of irregular reflection.

General properties (0.4mm thickness)

Test items Unit Treatment

ES-3551SF

(FR-4)

ES-3755SP

(CEM-3)

Appearance - - ES-3551SF ES-3755SP
Halogen-free - - Yes Yes
Resin dust fall % cf.footnote 0.031 0.019

Bending strength

Warp MPa A 541 514
Fill 471 438

Flexural modulus

Warp GPa A 37 35
Fill 35 33

CTE

(0.2mm thickness)

Warp ppm/℃ A 14

20

(Estimated)

Insulation resistance Nomal MΩ C-96/20/65 9×108 4×108

After

treament

C-96/20/65

+D-2/100

5×107 2×108
Dielectric constant (1MHz) - C-96/20/65 4.20 3.94
Dissipation factor (1MHz) -

C-96/20/65

+D-2/100

0.012 0.02

Chemical resistance

(60min)

Acetone - A OK OK
MEK
IPA
Reflow resistance -

240℃~250℃

15sec

No delamination

Solder resistance

(Float)

sec 260℃ 300< 300<
Appearance after heat treatment -

180℃

2hours

OK OK
Specific gravity - A 2.1 2.02
Water absorption %

E-24/50

+D/24/23

0.14 0.14
UL flammability - UL 94V-0 94V-0

☆The above figures do not show guaranteed value but one of a test result at our laboratory.

 

Test method:JIS K 6911 (Test piece is natural colored type)

Bending strength and Flexual modulus were measured on fulcrum distance of 16mm

CTE and Solder resistance are measured on JIS C 6481

 

<Treatment>

A=Accept state/ C=Constant Temperature & Humidity/ D=Dipping/ E=En- heating

Time/Temperature/Humidity

 

<Resin dust fall>

Resin dust fall(%) is defined as Weight change ratio of punched test pieces(0.4mm×90mm×50mm×12sheets) 

Before and After the treatment that they are shaken 500 times in a glass bottle