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Electronic material

General properties(Halogen-containing Glass/Epovy type)

General properties(Halogen-containing Glass/Epovy type)

Test items Unit Treatment ES-3711 ES-3753KP ES-3350
100% Nonwoven CEM-3 FR-4
Appearance ES-3711 ES-3753KP ES-3350
Resin dust % A 0.016 0.018 0.038
Bending strength Warp MPa A 225 548 619
Fill 148 513 559
Flexural modulus Warp GPa A 16 26 26
Fill 14 24 24
CTE Z-axis
(0.2mm)
ppm/℃ A 29 24
(Estimated value)
18
Insulation
resistance
at RT C-96/20/65 2×108 3×108 5×108
After
treatment
C-96/20/65
+D-2/100
4×104 3×107 4×107
Dk
(1MHz)
at RT - C-96/20/65 3.88 3.90 3.85
Df
(1MHz)
at RT - C-96/20/65 0.03 0.03 0.02
Chemical
resistance
(60min.)
Acetone - A OK OK OK
MEK OK OK OK
IPA
OK OK OK
Reflow resistance - 240~250℃
×15min.
OK OK OK
Solder limit(Float) sec. 260℃ 300< 300< 300<
Appearance after
heat treatment
- 180℃×2hrs. OK OK OK
Specific gravity - A 1.99 1.90 1.95
Water absorption % E-24-50
+D/24/23
0.29 0.15 0.12
Flame resistance - UL94 V-0 V-0 V-0

 

<Test method>
☆General test:JIS K6911

☆CTE & Solder limit:JIS C 6481

☆Flame resistance:UL-94

☆Bending strength & Flexural modulus:Fulcrum distance=16mm


<Resin dust fall>

Resin dust fall(%) is defined as Weight change ratio of punched test pieces(0.4mm×90mm×50mm×12sheets) 

Before and After the treatment that they are shaken 500 times in a glass bottle


*Above figures show the test result at our laboratory