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General properties(Halogen-free Glass/Epoxy type)
General properties(Halogen-free Glass/Epoxy type)
| Test items |
Unit |
Treatment |
Halogen-free |
| ES-3751S |
ES-3751 |
ES-3754SP |
ES-3351SF |
100%
Nonwoven |
100%
Nonwoven |
CEM-3 |
FR-4 |
| Appearance |
 |
 |
 |
 |
| Resin dust |
% |
A |
0.011 |
0.003 |
0.019 |
0.031 |
| Bending strength |
Warp |
MPa |
A |
210 |
200 |
514 |
541 |
| Fill |
150 |
140 |
438 |
471 |
| Flexural modulus |
Warp |
GPa |
A |
17 |
9 |
35 |
37 |
| Fill |
15 |
7 |
33 |
35 |
| CTE |
Z-axis
(0.2mm) |
ppm/℃ |
A |
26 |
30 |
20
（Estimate
value） |
14 |
Insulation
resistance |
at RT |
MΩ |
C-96/20/65 |
1×109 |
2×108 |
4×108 |
9×108 |
After
treatment |
C-96/20/65
+D-2/100 |
4×106 |
2×106 |
2×108 |
5×107 |
Dk
(1MHz) |
at RT |
- |
C-96/20/65 |
3.86 |
3.22 |
3.94 |
4.20 |
Df
(1MHz) |
at RT |
- |
C-96/20/65 |
0.02 |
0.02 |
0.02 |
0.012 |
Chemical
resistance
(60min.) |
Acetone |
- |
A |
OK |
OK |
OK |
OK |
| MEK |
OK |
OK |
OK |
OK |
IPA
|
OK |
OK |
OK |
OK |
| Reflow resistance |
- |
240～250℃
×15min. |
OK |
OK |
OK |
OK |
| Solder limit(Float) |
sec. |
260℃ |
300＜ |
300< |
300＜ |
300＜ |
Appearance after
heat treatment |
- |
180℃×2hrs. |
OK |
OK |
OK |
OK |
| Specific gravity |
- |
A |
1.83 |
1.24 |
2.02 |
2.1 |
| Water absorption |
% |
E-24-50
+D/24/23 |
0.31 |
0.58 |
0.14 |
0.14 |
| Flame resistance |
- |
UL94 |
V-0 |
V-0 |
V-0 |
V-0 |
|
<Test method>
☆General test:JIS K6911
☆CTE & Solder limit:JIS C 6481
☆Flame resistance:UL-94
☆Bending strength & Flexural modulus:Fulcrum distance=16mm
<Resin dust fall>
Resin dust fall(%) is defined as Weight change ratio of punched test pieces(0.4mm×90mm×50mm×12sheets)
Before and After the treatment that they are shaken 500 times in a glass bottle
*Above figures show the test result at our laboratory
|
