HOME > Products > Electronic material > High performance CCL > CS-3305K
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Non-Filler
Excellent Embeddability
CS-3305K
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| Product code |
Double sided
(Representative) |
CS-3305 |
| Single sided |
CS-3300 |
| Multilayer |
- |
| Prepreg |
ES-3310K |
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Features
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Applications
- Burn-in board.
- Component embedded substrate.
- Thermal resistant substrate.
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Through hole embeddability test |
○Specification of test substrate
- Thickness = 0.8mm (Cu 18μm double sided)
- Diameter of Plated Through Hole (PTH) = 0.4mm / 0.9mm
- Number of PTH = 540 / (100×100mm)
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○Prepreg
- ES-3310K (Prepreg of CS-3305K / Non-filler) = 0.06mm ×2-ply
- Comparison prepreg (Siliceous) = 0.06mm ×2-ply
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○Test method
- Two plies of prepreg were set on one side of the test substrate and pressed with it.
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| Image of embeddability test |
▼ES-3310K |
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Test results
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| <PTH = 0.4mm φ> |
| ES-3310K |
Comparison |
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| Voids were seen in the comparison |
<PTH = 0.9mm φ> |
| ES-3310K |
Comparison |
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PTHs were not entirely filled with resin in the comparison. |
General properties |
| Test items |
Unit |
Treatment |
CS-３３０５Ｋ |
| Halogen-free |
○ |
| Insulation resistance |
RT |
MΩ |
C-96/20/65 |
5×109 |
| After treatment |
+D-2/100 |
3×108 |
| Volume resistivity |
RT |
MΩm |
C-96/20/65 |
1×108 |
| After treatment |
+C-96/40/90 |
1×108 |
| Surface resistance |
RT |
MΩ |
C-96/20/65 |
6×109 |
| After treatmen |
+C-96/40/90 |
7×109 |
Dielectric constant
(1MHz) |
RT |
－ |
C-96/20/65 |
4.1 |
Dissipation factor
(1MHz) |
RT |
－ |
C-96/20/65 |
0.009 |
| Flexural strength |
Warp |
MPa |
Ａ |
510 |
| Fill |
450 |
Solder limit
（Float） |
300℃ |
sec |
Ａ |
300< |
| Peel strength |
18μm |
kN/m |
Ａ |
1.1 |
| Water absorption |
％ |
E-24/50
+D-24/23 |
0.10 |
UL flammability
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－ |
Ａ |
94V-0
equiv. |
| Glass transition temperature |
TMA |
℃ |
Ａ |
240 |
| DMA |
300 |
| Flexural modulus |
Warp |
GPa |
Ａ |
25 |
| Fill |
24 |
| Hot flexural modulus |
Warp |
GPa |
200℃ |
15 |
| Fill |
13 |
Coefficient of thermal expansion
（α1） |
Z |
ppm/℃ |
Ａ |
50～60 |
| X |
11～13 |
| Y |
12～14 |
Coefficient of thermal expansion
（α2） |
Z |
ppm/℃ |
Ａ |
200～210 |
*Above figures show the test result of a 1.6mm substrate at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications
| Substrate thickness (mm) |
0.10 / 0.15 / 0.20 / 0.30 / 0.40 / 0.60 / 0.80 / 1.00 / 1.20 / 1.40 / 1.60 |
| Cu thickness (μm) |
12 / 18 / 35 / 70 |
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