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HOME > Products > Electronic material > High performance Copper > CS-3305KA

Electronic material

CS-3305KA

RISHOLITE
Product code
Double sided
(Representative)
CS-3305KA
Unclad -
Multilayer -
Prepreg ES-3310KA

Middle CTE

Excellent PTH reliability

 

CS-3666Z

 

Features

  • Excellent in Plated Through Hole (PTH) reliability

  • Excellent in Thermal resistance (Tg=300℃ / DMA) and Low water absorption of 0.09%.

              • Excellent in Long term thermal resistance.
              • Halogen-free.

 

Applications

  • Burn-in board.
  • Component embedded substrate.
  • Thermal resistant substrate.

 

Reliability test of PTH

 

○Specification of test substrate

  • Number of layer = 4-layer
  • Core = CS-3305KA / 0.2mm thick. / 35μm Cu double-sided
  • Outer = ES-3310KA (prepreg of CS-3305KA) / 0.06mm thick ×2-ply / 35μm Cu
  • Diameter of PHT = 0.2mm
  • Number of PTH = 240 (30×8)
  • Pitch of PTHs = 0.5mm
  • Plating thick. = 20μm

 

○Condition of thermal cycle test

  • -55℃ (30min) ⇔ 150℃ (30min) ×2000-cycle

 

ES-3310KA

▲ES-3310KA

 

<Test result>

coplanarity

Resistance value of each samples are stable.Consequently,it can be evaluated that CS-3305KA is excellent in PTH reliability.

 

General properties

Test items Unit Treatment

CS-3305KA

Halogen-free
Insulation resistance RT C-96/20/65 4.2×108
After treatment +D-2/100 2.5×108
Volume resistivity RT MΩm C-96/20/65 4.2×108
After treatment +C-96/40/90 2.6×108
Surface resistance RT C-96/20/65 1.8×1010
After treatment +C-96/40/90 1.1×1010

Dielectric constant

(1MHz)

RT C-96/20/65 4.4

Dissipation factor

(1MHz)

RT C-96/20/65 0.007
Flexural strength Warp MPa 530
Fill 450
Solder limit

(Float)

300℃ sec 300<
Peel strength 35μm kN/m 1.6
Water absorption E-24/50
+D-24/23
0.09
UL flammability

94V-0

equiv.

Glass transition temperature TMA 240
DMA 300
Flexural modulus Warp GPa 26
Fill 25
Hot flexural modulus Warp GPa 200℃ 18
Fill 16

Coefficient of thermal expansion

(α1

Z ppm/℃ 50-100℃ 30~40
X

11~13

Y 12~14
*Above figures show the test result of 1.6mm substrate at our laboratory
*Test method is JIS C 6481 except UL flammability

 

Standard specifications

Substrate thickness (mm)

0.10 / 0.20 / 0.30 / 0.40 / 0.60 / 0.80 / 1.00 / 1.20 / 1.40 / 1.60

Cu thickness (μm) 12 / 18 / 35 / 70