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HOME > Products > Electronic material > High performance Copper > CS-3355S

Electronic material

CS-3355S

RISHOLITE  

Low CTE of 26ppm

 

CS-3355S

 

CS-3355S

 

Product code
Double sided
(Representative)
CS-3355S
Single sided CS-3350S
Multilayer CS-4357S
Prepreg ES-3305S
Core CS-3357S

 

Features

  • Fit for multilayer build-up core with excellent flexural modulus of 30GPa
  • Excellent in PTH reliability,twice as much as FR-4 CCL,with Low CTE property of 26ppm/℃
  • 35%~70% less heat shrinkage than FR-4 CCL
  • Prepreg (ES-3305S) is laser-drillable.
  • Excellent in heat release property
  • Excellent in moisture resistance with half water absorption property of FR-4 CCL
  • Excellent in price/performance

 

Applications

Thin PWB

  • Build up core
  • Laser drillable prepreg for build up processing
General properties    
Test items Unit Treatment CS-3355S
Halogen free - - No
Grade ANSI - - FR-4 Equive.
JIS - - GE4F
Insulation resistance at RT C-96/20/65 5×108
After treatment +D-2/100 2×106
Volume resistivity at RT MΩm C-96/20/65 5×109
After treatment +C-96/40/90 1×108
Surface resistance at RT C-96/20/65 3×107
After treatment +C-96/40/90 2×106
Dk(1MHz) at RT - C-96/20/65 4.4
Df(1MHz) at RT - C-96/20/65 0.018
Flexural strength Warp MPa A 500
Fill 455
Solder limit
(Float)
260℃ sec. A 300<
Peel strength 18μm kN/m A 1.5
Water absorption % E-24/50
+D-24/23
0.07
UL Flammability
- A 94V-0
Tg TMA A 135
DMA 155
Flexural modulus Warp GPa A 30
Fill 28
CTE α1 Z-axis ppm/℃ A 26
Warp 12
Fill 13
CTE α2 Z-axis ppm/℃ A 180
Thermal expansion
(20~260℃)
Z-axis % A 2.4
Thermal conductivity(Probe) W/mK A 0.7

*Above figures show the test result of 0.8mm thickness material at our laboratory
*Test method is JIS C 6481 except UL flammability

 

Standard specifications

Substrate thickness (mm)

0.06/ 0.1/ 0.15/ 0.2/ 0.3/

0.4/ 0.5/ 0.6/ 0.8/ 1.0/ 1.2/ 1.6

Cu thickness (μm) 12 / 18 / 35

CCL with customized thickness is also negotiable.