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High Dielectric constant PPE |
Dk=11.3@1GHz
CS-3396
|
Product code |
Double sided
(Representative) |
CS-3396 |
Single sided |
- |
Multilayer |
- |
Prepreg |
ES-3346 |
Core |
- |
|
Features
- Excellent in handleability with flexural modulus of 14GPa.
- Excellent in thermal conductivity of 1W/mK.
- Available for mulytilayer processing.
|
Applications
- Downsizing of HF substrate (Antenna,Sensor and so on).
- Device embedded substrate.
|
Dependance of Dk & Df on frequency
Test method:Balanced-type circular disk resonator |
Dependance of Dk & Df on temperature
Test method:Balanced-type circular disk resonator |
Change of Dk & Df after Humidity treatment
Test method:Cavity Resonance Method
Test condition:60℃/90%
Frequency = 7GHz |
General properties |
Test items |
Unit |
Treatment |
CS-3396 |
Insulation resistance |
Normal condition |
MΩ |
C-96/20/65 |
5.0×108 |
After treatment |
+D-2/100 |
1.2×107 |
Volume resistivity |
Normal condition |
MΩm |
C-96/20/65 |
4.1×107 |
After treatment |
+C-96/40/90 |
1.3×107 |
Surface resistance |
Normal condition |
MΩ |
C-96/20/65 |
1.7×109 |
After treatment |
+C-96/40/90 |
2.0×108 |
Dielectric constant
(1GHz) |
RF I-V method |
- |
A |
11.6 |
Stripline method |
9.5 |
Dissipation factor |
RF I-V method |
- |
A |
0.003 |
Stripline method |
0.003 |
Solder limit |
288℃ |
sec |
288℃ |
300< |
Peel strength |
Cu 35μm |
kN/m |
A |
1.0 |
Flexural strength |
Warp / Fill |
MPa |
A |
330/290 |
Flexural modulus |
Warp / Fill |
GPa |
A |
14/14 |
Water absorption |
% |
23℃/24Hr |
0.02
(1.6mm) |
Specific gravity |
g/cm3 |
- |
2.8 |
Thermal conductivity
(Laser flash method) |
W/mK |
A |
1.0 |
CTE(α1) |
Warp / fill / Thickness |
ppm/℃ |
A |
15/15/55 |
Tg |
DMA |
℃ |
A |
180 |
UL flammability |
- |
UL94 |
94V-1 equiv. |
*Test method is JIS C 6481(Test piece thickness=1.6mm)
*The various above-mentioned data is measured value , and is not guarnteed ferformance. |
Standard specifications
Substrate thickness (mm) |
0.14 / 0.28 / 0.42 / 0.56 / 0.84 / 1.12 / 1.54 |
Cu thickness (μm) |
18 / 35 |
CCL with customized thickness is also negotiable. |
Sister products |
▲Prepreg/ES-3346 |
▲Resin Coated Copper
/CD-3396 |
▲Bonding sheet/AD-3396 |
▲Nonreinforced CCL
/CC-3396 |