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HOME > Products > Electronic material > Aluminum PWB material > AC-7302

Electronic material

Aluminum base PWB material / Solder crack resistant type

risholite

Excellent Solder Crack resistance

AC-7302

AC-7200TY

λ=2W/mK

 

Composition

Application

Reduction of solder crack caused by thermal expansion of Aluminum plate of PCB

Standard specification
Items Specifications

Tickness of insulation layer

(μm)

100

Thickness of Cu foil

(μm)

 70

Thickness of Aluminum plate

(mm)

 1.5

Shipping size

(mm)

510mm　×　510mm

340mm　×　510mm

and so on

Breakdown voltage
Test results show that insulation layer of 0.1mm thickness can withstand voltage of 6300V on average

Long term reliability

<Breakdown voltage>

Test results show that AC-7302 has insulation strength of at least more than50kV/mm under such conditions as follows.

  • For 3000 hours under 150℃
  • For 3000 hours under both Temperature of 85℃ and Humidity of 85%
  • For 3000-time thermal cycles between -55℃(30min) and 150℃(30 min).
　<Test piece>

 

Test method (JIS C 2110)

  • Step up voltage at a rate of 500V a second up to breakdown.

 

Thickness

  • Aluminum plate = 1.5mm
  • Insulation layer = 100μm
  • Cu foil = 70μm
  • n = 150

 

Test condition

  • Positive electrode = Cu foil (25mmφ)
  • Negative electrode = Alumimun plate
  • Applied current = AC
  • Leakage current = 10mA (Max)

<Peel strength>

Test results show that AC-7302 has peel strength of at least more than1000 N/m under such conditions as follows.

  • For 3000 hours under 150℃
  • For 3000 hours under both Temperature of 85℃ and Humidity of 85%
  • For 3000-time thermal cycles between -55℃(30min) and 150℃(30 min).

Migration resistance

Atomosphere　=　 Temperature:85℃ / Humidity:85%

Applied voltage = DC 100V (Vertical to layers)

Positive = Cu

Negative = Al
Test results show that AC-7302 is excellent in connection reliability even in high humidity atomoshere.

General properties
Test items Unit Treatment 7302 Remarks

Thermal conductivity

（Laser flash　method）

 W/mK A 2 Insulation layer

Glass transition temperature

（DMA）

 ℃ A

165
Coefficient of thermal expansion α1 ppm/℃ A 35
α2 ―
Storage elastic modulus -40℃ GPa A 5
25℃ 0.08
125℃ 0.004

Thermal conductivity

（TIM tester method）

 W/mK A 2

Aluminum base

PWB material
Peel strength 35μm kN/m A ―
70μm 1.5
105μm ―
Solder limit 300℃ sec. A 300<
UL flammability - UL94

V-0

equiv.

The above figures are not guaranteed value but one of the test results at our laboratories.