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HOME > Products > Electronic material > Aluminum PWB material > AC-7303

Electronic material

Aluminum base PWB material / Solder crack resistant type

risholite

Excellent Solder crack resistance

AC-7303

AC-7200TY

λ=3W/mK

Composition

▲Insulation layer after thermosetting

Soft insulation layer can absorb thermal expansion of Aluminum plate and release stress at soldered parts

<Image of solder crack generation and a countermeasure against it>

Test results of solder crack resistance
Test condition of thermal recycle : -40℃ (30min) ⇔ 125℃ (30min) × 1000-cycle
▲AC-7303 ▲Comparison material

Standard specification
Items Specifications

Thickness of insulation layer

(μm)

120

Thickness of Cu foil

(μm)

 35 / 70 / 105

Thickness of Aluminum plate

(mm)

 1.0 / 1.5 / 2.0

Shipping size

(mm)

510mm　×　510mm

340mm　×　510mm

and so on

Application

Reduction of solder crack caused by thermal expansion of Aluminum plate of PCB

Breakdown voltage
Test results show that insulation layer of 0.12mm thickness can withstand voltage of 6400V on average
　<Test piece>

Test method (JIS C 2110)

  • Step up voltage at a rate of 500V a second up to breakdown.

 

Thickness

  • Aluminum plate = 1.5mm
  • Insulation layer = 120μm
  • Cu foil = 35μm
  • n = 150

 

Test condition

  • Positive electrode = Cu foil (25mmφ)
  • Negative electrode = Alumimun plate
  • Applied current = AC
  • Leakage current = 3mA (Max)

Long term reliability

<Breakdown voltage>

Test results show that AC-7303 has insulation strength of at least 5kV under such conditions as follows.

  • For 3000 hours under 175℃
  • For 3000 hours under both Temperature of 85℃ and Humidity of 85%
  • For 3000-time thermal cycles between -55℃(30min) and 125℃(30 min).

<Peel strength>

Test results show that AC-7303 has peel strength of at least more than 0.5kN/m under such conditions as follows.

  • For 3000 hours under175℃
  • For 3000 hours under both Temperature of 85℃ and Humidity of 85%
  • For 3000-time thermal cycles between -55℃(30min) and 125℃(30 min).

 

Migration resistance

Atomosphere　=　 Temperature:85℃ / Humidity:85%

Applied voltage = DC 100V (Vertical to layers)

Positive = Cu

Negative = Al
Test results show that AC-7303 is excellent in connection reliability even in high humidity atomoshere.

Proposal from RISHO

AC-7303 could be installed with a gentle curved shape.

We expect AC-7303 would be used in LED lighting equipment with unique design.

General properties
Test items Unit Treatment 7303 Remarks

Thermal conductivity

（Laser flash method）

 W/mK A 3 Insulation layetr

Glass transition temperature

（DMA）

 ℃ A

-20

177

Young's modulus

(RT）

 GPa A 2.4
Poisson's ratio - A 0.27
Dielectric constant 1MHz - A 6.16
Dissipation factor 1MHz - A 0.027

Thermal conductivity

(TIM tester method）

 W/mK A 3 Aluminum base PWB material
Peel strength 35μm kN/m A 0.9
70μm kN/m A 1.2
Solder limit 300℃ sec. A 600<
Surface resistance MΩ C-96/20/65 6.5×108
Volume resistivity MΩ・m C-96/20/65 1.0×106
UL flammability - UL94

V-0

equiv.

The above figures are not guaranteed value but one of the test results at our laboratories.