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Electronic material > High thermal conductive bonding sheet > CD-7004
CD-7004 / Resin Coated Copper
λ=3W/mK
|
CD-7004
|
Material composition |
 |
Specifications |
| ＜Dimensions＞ |
| Product code |
Dimensions (mm) |
CD-7004 |
510mm × 510mm
340mm × 510mm
and so on |
|
＜Thickness＞ |
| Product code |
Insulation layer
(μm) |
Copper foil
(μm) |
Tolerance
(μm) |
CD-7004 |
80 / 120 |
35 / 70 / 105 |
80±15 / 120±20 |
|
General properties of insulating layer |
| Test items |
Unit |
Treatment |
7004 |
| Thickness of insulation layer |
μm |
－ |
80/120 |
| Halogen-free |
－ |
－ |
○ |
| Peel strength |
kN/m |
35μm |
1.5 |
Glass transition temperature
(TMA) |
℃ |
A |
182 |
| Coefficient of thermal expansion |
ppm/℃ |
α1 |
27 |
| α2 |
48 |
Thermal conductivity
（Laser flash） |
W/mK |
A |
3 |
| Handling ability |
－ |
－ |
△ |
Breakdown voltage
（80μm） |
kV |
In oil
Vertical to layer |
4< |
Solder limit |
sec |
260℃
float |
300< |
| Volume resistivity |
MΩm |
C-96/20/65 |
5.0×106 |
| Surface resistance |
MΩ |
C-96/20/65 |
1.0×109 |
|
| The various above-mentioned data is measured value, and is not guaranteed performance. |
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