HOME > Products > Electronic material > FPC stiffener > Halogen-free film type
Appearance
 
▲IS-3711 ▲IS-3710 |
Properties
☆Compared to PI film stiffener
- Excellent in price performance
- .Less warpage with moderate stiffness
- .Excellent in adhesion to bonding shee
Compared to FR-4 material
- Less resin dust at punching process
|
Composition
 
▲IS-3711 |
[Punching workability]
 |
 |
| ▲FR-4 (200μm thickness) |
▲IS-3711 (175μm thickness) |
|
General properties
| Test items |
Unit |
Treatment |
IS-3711 |
IS-3710 |
PI film
（Comparative） |
| Halogen-free |
- |
- |
Yes |
Yes |
Yes |
| Resin dust fall |
% |
cf.footnote |
0.002 |
0.003 |
0.000 |
Bending strength
(400μm) |
Warp |
MPa |
A |
172 |
144 |
- |
| Fill |
218 |
184 |
- |
Flexural modulus
(400μm) |
Warp |
GPa |
A |
7 |
7 |
- |
| Fill |
8 |
8 |
- |
| Warpage |
Nomal |
mm |
cf.footnote |
1.7 |
5.1 |
5.7 |
After
treament |
1.0 |
1.8 |
5.6 |
| Dimensional change |
Warp |
% |
cf.footnote |
-0.16 |
-0.22 |
-0.12 |
| Fill |
-0.25 |
-0.31 |
-0.10 |
Chemical resistance
(60min) |
Acetone |
- |
A |
OK |
OK |
OK |
| MEK |
| IPA |
| Deflection |
mm |
cf.footnote |
35 |
36 |
74 |
| Reflow resistance |
- |
240℃～250℃
15sec |
OK |
ＯＫ |
ＯＫ |
| Solder resistance (Float) |
sec |
260℃ |
300< |
300< |
300< |
| Appearance after heat treatment |
- |
180℃
2hours |
OK |
OK |
OK |
| Water absorption |
% |
E-24/50
+D/24/23 |
1.13 |
1.04 |
2.36 |
| UL flammability |
- |
UL |
94V-0 |
94V-0 |
94V-0 |
☆The above figures show one of test result
Test method:JIS K 6911 (Except Resin dust fall,Warpage,Dimensional change and Deflection)
Bending strength and Flexual modulus were measured on fulcrum distance of 16mm
<Resin dust fall>
Resin dust fall(%) is defined as Weight change ratio of punched test pieces(90mm×50mm×12sheets)
Before and After the treatment that they are shaken 500 times in a glass bottle
<Warpage and Dimensional change>
Maximum Uplift and Dimensional change of a test piece (150mm×150mm）on a surface plate were measured after the following treatment
Baking(125℃×24hours） → Full humidity absorption(30℃／70%／144hours） → Reflow(Mam.255℃／Holding time30±10sec) → Humidification(30℃／70%／96hours) → Reflow
|
<Deflection>
Deflection was measured as the above figure |
