HOME > Products > Electronic material > High performance CCL > CS-3295
3.0W/mK / High thermal conductive / CS-3295
 |
λ=3W/mK |
CS-3295
|
| Product code |
Double sided
(Representative) |
CS-3295 |
| Single sided |
- |
| Multilayer |
- |
| Prepreg |
ES-3245 |
| Core |
- |
|
■Features |
- Thermal conductivity ,3.0W/mK, is more than ten times of FR-4.
- High flexural modulus (28GPa)
- Thin laminates up to 0.06mm is available.
- Available for Multilayer processing.
- Prepreg,ES-3245,is also available as heat release structural material.
|
■Applications |
- LED substrate
- Power semiconductor substrate.
|
■Low thermal resistance of thin substrate |
|
|
CS-3295 which consists of only Glass fabric can be made into so thin substrate as 0.06mm that heat can conduct smoothly through this thinness. |
■Insulation property according to temperature |
 |
| CS-3295 is excellent in insulation property even under 200℃ which power devices operate. |
|
■Insulation strength according to thickness |
| Thicknesse（mm） |
Breakdown voltage（kV） |
| 0.06 |
（0.06t×1ply） |
3 |
| 0.1 |
（0.1t×1ply） |
5 |
| 0.12 |
（0.06t×2ply） |
9 |
| 0.2 |
（0.2t×1ply） |
10＜ |
|
| CS-3295 is excellent in insulation property (3000V) even so thin as 0.06mm |
■Reliability on electrical conductivity |
| Test item |
Condition |
Test result |
Surface migration
（L/S＝100/100） |
85℃/85％ DC50V |
2000Hr / Pass |
Plated Through Hole reliability
（Hot oil test） |
260℃/10sec.⇔20℃/20sec. |
100cyc / Pass |
Heat cycle test
（Gas phase） |
125℃/30min.⇔-55℃/30min. |
2000cyc / Pass |
|
| ☆Specimen：4-layer CCL (35μm inner circuit / Total thich=0.7mm) |
| CS-3295 is excellent in conductive reliability under tough atmosphere. |
■General properties |
| Test items |
Unit
|
Treatment
|
CS-3295 |
| Halogen free |
YES |
Insulation resistance |
RT |
MΩ |
C-96/20/65 |
6.5×108 |
After tratment |
+D-2/100 |
2.5×105 |
Volume resistivity
|
RT |
MΩm |
C-96/20/65 |
1.5×107 |
After tratment
|
C-96/40/90 |
1.3×105 |
| Surface resistance |
RT |
MΩ |
C-96/20/65 |
6.8×108 |
After tratment |
C-96/40/90 |
2.1×107 |
Dielectric constant |
1MHz |
－ |
C-96/20/65 |
6.2 |
Dissipation factor |
1MHz |
－ |
C-96/20/65 |
0.010 |
| Specific gravity |
－ |
A |
2.9 |
| Water absorption (0.4mm) |
% |
23℃/24Hr |
0.2 |
| Flexural modulus |
Warp／Fill |
GPa |
A |
28/28 |
Solder limit |
260℃ |
sec |
A |
300 OK |
Peel strength |
35μｍ |
kN/m |
A |
1.0 |
Thermal conductivity |
Laser flash method |
W/mK |
A |
3 |
TIM tester method |
3 |
Coefficient of Thermal Expansion （α1） |
X / Y / Z |
ppm/℃ |
A |
13／13／17 |
| Coefficient of Thermal Expansion （α2） |
X / Y / Z |
ppm/℃ |
A |
17／17／68 |
| Tg |
DMA |
℃ |
A |
180 |
| Tracking resistance |
IEC |
― |
A |
600 |
| Flammability |
― |
UL94 |
94V-0 equive. |
| Breakdown voltage |
kV |
Vertical to layer
in oil |
10<
(0.2mm) |
|
*Above figures show the test result of 1.0mm thickness material at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications |
| Substrate thickness (mm) |
0.06 / 0.1 / 0.2 / 0.4 |
| Cu thickness (μm) |
18 / 35 / 70 |
CCL with customized thickness is also negotiable. |
