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HOME > Products > Electronic material > High performance CCL > CS-3305

Electronic material

CS-3305

RISHOLITE

 

Tg>300℃

High Modulus High Heat Resistant CCL

 

CS-3305

CS-3305

About icons

Product code
Double sided
(Representative)
CS-3305
Single sided
CS-3300
Multilayer
-
Prepreg

Features

            • Excellent flexural modulus and low warpage under Elevated temperature.

              • Flexural Modulus:34GPa(R.T.) / 19GPa(250℃)
              • High Tg(>300℃)
              • Low water absorption
              • Excellent in laser workability
              • CTE(α1)：11-13ppm(XY )/ 24ppm(Z)
              • Halogen-free,Phosphorous free.

Applications


  • IC packages substrate.
  • Build-up core.

 

Strage elastic modulus / Coefficient of loss

strage elastic modulus

 

Warpage test

warpage test

 

Laser workability (Blind via / 65μmφ)

laser workability

Insulation layer thickness =25μm

 

Laser workability(Through hole)

laser workability

General properties
Test items Unit Treatment CS-3305
Halogen free compliance - - OK
Grade ANSI - - FR-5 equiv.
JIS - - GE2F
Insulation resistance at RT MΩ C-96/20/65 4×109
After treatment +D-2/100 2×108
Volume resistivity at RT MΩm C-96/20/65 1×107
After treatment +C-96/40/90 7×107
Surface resistance at RT MΩ C-96/20/65 1×109
After treatment +C-96/40/90 1×107

Dielectric constant

(1MHz)

 at RT - C-96/20/65 3.9

Dissipation factor

(1MHz)

 at RT - C-96/20/65 0.007
Flexural strength Warp MPa A 566
Fill 558
Solder limit
(Float)		 260℃ sec. A 300<
Peel strength 12μm kN/m A 0.8
Water absorption % E-24/50
+D-24/23		 0.13
UL Flammability
 - A 94V-0 equiv.
Tg TMA ℃ A 275
DMA 300<
Flexural modulus Warp GPa A 34
Fill 33
Hot flexural modulus Warp 250℃ 19
Fill 19
CTE α1 Z-axis ppm/℃ A 24
Warp 12
Fill 12
CTE α2 Z-axis ppm/℃ A 53
Thermal expansion
(20～260℃)		 Z-axis % A 0.92

Thermal conductivity

(Laser flash)

 W/mK A 0.6

*Above figures show the test result of 0.8mm material at our laboratory
*Test method is JIS C 6481 except UL flammability

 

Standard specifications

Substrate thickness (mm) 0.05 / 0.06 / 0.1 / 0.2
Cu thickness (μm) 12 / 18 / 35

CCL with customized thickness is also negotiable.