The above graph shows that CS-3305A retained enough elastic modulus even after 300℃ heat treatment.As a result, it could be evaluated that CS-3305A would have little warpage at reflow soldering process.
■Long term thermal resistance
＜Loss on heat＞
Resin base substrate,like CS-3305A,is apt to lose weight with bond cleavage of molecule under high temperature atomosphere.On the other hand, CS-3305A lost little weight even under atomosphere of 175℃ for 2000 hours.
＜Peel strength＞
Peel strength of Cu foil is apt to decrease under high temperature atomosphere On the other hand ,CS-3305A lost little peel strength even after 175℃ heat treatment for 2000 hours.
■General properties
Test items
Unit
Treatment
CS-3305A
Halogen free compliance
-
-
OK
Grade
ANSI
-
-
FR-5 equiv.
JIS
-
-
GE2F
Insulation resistance
at RT
MΩ
C-96/20/65
3×109
After treatment
+D-2/100
1×108
Volume resistivity
at RT
MΩm
C-96/20/65
1×108
After treatment
+C-96/40/90
8×107
Surface resistance
at RT
MΩ
C-96/20/65
8×109
After treatment
+C-96/40/90
4×107
Dielectric constant
(1MHz)
at RT
-
C-96/20/65
4.1
Dissipation factor
(1MHz)
at RT
-
C-96/20/65
0.010
Flexural strength
Warp
MPa
A
520
Fill
510
Solder limit
(Float)
260℃
sec.
A
300<
Peel strength
12μm
kN/m
A
0.8
Water absorption
%
E-24/50
+D-24/23
0.13
UL Flammability
-
A
94V-0 equiv.
Tg
TMA
℃
A
-
DMA
300<
Flexural modulus
Warp
GPa
A
35
Fill
33
Hot flexural modulus
Warp
250℃
19
Fill
19
CTE α1
Z-axis
ppm/℃
A
15 - 25
Warp
10 - 12
Fill
10 - 12
CTE α2
Z-axis
ppm/℃
A
-
Thermal expansion
(20～260℃)
Z-axis
%
A
0.6
Thermal conductivity
(Laser flash)
W/mK
A
0.5
*Above figures show the test result of 0.8mm material at our laboratory
*Test method is JIS C 6481 except UL flammability
