Excellent in Thermal resistance (Tg=300℃ / DMA) and Low water absorption of 0.1%.
Excellent in Long term thermal resistance.
Halogen-free.
Applications
Burn-in board.
Component embedded substrate.
Thermal resistant substrate.
Through hole embeddability test
○Specification of test substrate
Thickness = 0.8mm (Cu 18μm double sided)
Diameter of Plated Through Hole (PTH) = 0.4mm / 0.9mm
Number of PTH = 540 / (100×100mm)
○Prepreg
ES-3310K (Prepreg of CS-3305K / Non-filler) = 0.06mm ×2-ply
Comparison prepreg (Siliceous) = 0.06mm ×2-ply
○Test method
Two plies of prepreg were set on one side of the test substrate and pressed with it.
Image of embeddability test
▼ES-3310K
Test results
<PTH = 0.4mm φ>
ES-3310K
Comparison
Voids were seen in the comparison
<PTH = 0.9mm φ>
ES-3310K
Comparison
PTHs were not entirely filled with resin in the comparison.
■Breakdown voltage at high temperature
ES-3310K (Prepreg of CS-3305K) with thickess of only 60μm keeps enough insulation strength even at 200℃ assumed to be temperature around SiC power semiconductors.
■General properties
Test items
Unit
Treatment
CS-３３０５Ｋ
Halogen-free
○
Insulation resistance
RT
MΩ
C-96/20/65
5×109
After treatment
+D-2/100
3×108
Volume resistivity
RT
MΩm
C-96/20/65
1×108
After treatment
+C-96/40/90
1×108
Surface resistance
RT
MΩ
C-96/20/65
6×109
After treatmen
+C-96/40/90
7×109
Dielectric constant
(1MHz)
RT
－
C-96/20/65
4.1
Dissipation factor
(1MHz)
RT
－
C-96/20/65
0.009
Flexural strength
Warp
MPa
Ａ
510
Fill
450
Solder limit
（Float）
300℃
sec
Ａ
300<
Peel strength
18μm
kN/m
Ａ
1.1
Water absorption
％
E-24/50
+D-24/23
0.10
UL flammability
－
Ａ
94V-0
equiv.
Glass transition temperature
TMA
℃
Ａ
240
DMA
300
Flexural modulus
Warp
GPa
Ａ
25
Fill
24
Hot flexural modulus
Warp
GPa
200℃
15
Fill
13
Coefficient of thermal expansion
（α1）
Z
ppm/℃
Ａ
50～60
X
11～13
Y
12～14
Coefficient of thermal expansion
（α2）
Z
ppm/℃
Ａ
200～210
*Above figures show the test result of a 1.6mm substrate at our laboratory
*Test method is JIS C 6481 except UL flammability
