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HOME > Products > Electronic material > High performance Copper > CS-3305KA

Electronic material

CS-3305KA

RISHOLITE
Product code
Double sided
(Representative)		 CS-3305KA
Unclad ES-3300KA
Multilayer -
Prepreg ES-3310KA

Middle CTE

Excellent PTH reliability

 

CS-3666Z

 

■Features
  • Excellent in Plated Through Hole (PTH) reliability.
  • Tg=300℃ (DMA).
  • Excellent in Long term thermal resistance.
  • Halogen-free.
    		•

     

    ■Applications

  • Device embedded substrate.
  • Automotive substrate.
  • Power module substrate.
    		•

     

    ■Reliability test of PTH

    ○Specification of test substrate

  • Number of layer = 4-layer
  • Core = CS-3305KA / 0.2mm thick. / 35μm Cu double-sided
  • Outer = ES-3310KA (prepreg of CS-3305KA) / 0.06mm thick ×2-ply / 35μm Cu
  • Diameter of PHT = 0.2mm
  • Number of PTH = 240 (30×8)
  • Pitch of PTHs = 0.5mm
  • Plating thick. = 20μm
    		•

     

    ○Condition of thermal cycle test

  • -55℃ (30min) ⇔ 150℃ (30min) ×2000-cycle

    •  
    ES-3310KA

    ▲ES-3310KA

     

    <Test result>

    coplanarity

     

    Resistance value of each samples are all stable.This result shows that CS-3305KA is excellent in Plated Through Hole reliability.

     

    ■Long term heat rsistance (175℃)

     

    Loss on heat is within 10% even through heat treatment of 175℃ for 10 thausant hours. 175℃ is assumed to be junction temperature of power semiconductors.This result shows that CS-3305KA is excelent in long term heat reistance reliability.

     

    ■Breakdown voltage at high temperature

     

    ES-3310KA (Prepreg of CS-3305KA) with thickess of only 60μm keeps enough insulation strength even at 200℃ assumed to be temperature around SiC power semiconductors.　

     

    ■Flexural modulus accorging to temperature

     

    ES-3300KA (Copper unclad laminates of CS-3305KA) keeps enough strength over 200℃
     

     

    General properties
    Test items Unit Treatment

    CS-3305KA
    Halogen-free ○
    Insulation resistance RT MΩ C-96/20/65 4.2×108
    After treatment +D-2/100 2.5×108
    Volume resistivity RT MΩm C-96/20/65 4.2×108
    After treatment +C-96/40/90 2.6×108
    Surface resistance RT MΩ C-96/20/65 1.8×1010
    After treatment +C-96/40/90 1.1×1010

    Dielectric constant

    (1MHz)

    		 RT － C-96/20/65 4.4

    Dissipation factor

    (1MHz)

    		 RT － C-96/20/65 0.007
    Flexural strength Warp MPa Ａ 530
    Fill 450
    Solder limit

    （Float）

    		 300℃ sec Ａ 300<
    Peel strength 18μm kN/m Ａ 1.1
    Water absorption ％ E-24/50
    +D-24/23    		 0.09
    UL flammability
    		 － Ａ

    94V-0

    equiv.
    Glass transition temperature TMA ℃ Ａ 240
    DMA 300
    Flexural modulus Warp GPa Ａ 26
    Fill 25
    Hot flexural modulus Warp GPa 200℃ 18
    Fill 16

    Coefficient of thermal expansion

    （α1）

    		 Z ppm/℃ 50-100℃ 30～40
    X

    11～13
    Y 11～13
    Thermal conductivity ASTM D5470 W/mK Ａ 0.6-0.7
    *Above figures show the test result of 1.6mm substrate at our laboratory
    *Test method is JIS C 6481 except UL flammability

     

    Standard specifications

    Substrate thickness (mm)

    0.10 / 0.20 / 0.30 / 0.40 / 0.60 / 0.80 / 1.00 / 1.20 / 1.40 / 1.60
    Cu thickness (μm) 12 / 18 / 35 / 70