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Low dielectric PPE |
Dk=3.4@1GHz
Df=0.0038@1GHz
CS-3376B

|
Product code |
Double sided
(Representative) |
CS-3376B |
Single sided |
- |
Multilayer |
CS-4378B |
Prepreg |
ES-3317B |
Core |
CS-3378B |
|
Features
- CCL to make multi layer PWB.
- Tg = 220℃
- Excellent in thickness accuracy and contribute to impedance control.
|
Applications
- Semiconductor inspection substrate.
- Survers,Routers.
- Fillers.
|
Transmission loss |
 |
<Measurement condition> |
|
Substrate thickness |
0.8mm |
Cu thickness |
35μm |
Line length |
20cm |
Characteristic impedance |
15Ω |
|
Dielectric properties according to temperature |
<Dielectric constant> |
<Dissipation factor> |
 |
 |
|
General properties |
Test items |
Unit |
Treatment |
CS-3376B |
Halogen free compliance |
- |
- |
NO |
Grade |
ANSI |
- |
- |
- |
JIS |
- |
- |
- |
Insulation resistance |
at RT |
MΩ |
C-96/20/65 |
2×107 |
After treatment |
+D-2/100 |
5×106 |
Volume resistivity |
at RT |
MΩm |
C-96/20/65 |
5×106 |
After treatment |
+C-96/40/90 |
2×106 |
Surface resistance |
at RT |
MΩ |
C-96/20/65 |
5×107 |
After treatment |
+C-96/40/90 |
3×106 |
Dielectric constant
(1GHz) |
at RT |
- |
A |
3.4 |
Dissipation factor
(GMHz) |
at RT |
- |
A |
0.004 |
Flexural strength |
Fill |
MPa |
A |
380 |
Solder limit
(Float) |
260℃ |
sec. |
A |
300< |
Peel strength |
18μm |
kN/m |
A |
1.1 |
Water absorption |
% |
E-24/50
+D-24/23 |
0.17 |
UL Flammability
|
- |
A |
94V-0 |
Tg |
TMA |
℃ |
A |
190 |
DMA |
220 |
CTE |
Warp-α1 |
ppm/℃ |
A |
13 |
Fill-α1 |
13 |
Z-α1 |
53 |
Z-α2 |
180 |
*Above figures show the test result of 1.6mm thickness material at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications
Substrate thickness (mm) |
0.1 / 0.15 / 0. 2/ 0.3 / 0.4 / 0.5 / 0.6 / 0.7 |
Cu thickness (μm) |
12 / 18 / 35 / 70 |
CCL with customized thickness is also negotiable.
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