HOME > Products > Electronic material > High performance Copper AD-3379H
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Dk=3.01 / Df=0.0019 @80GHz |
Low Dk & Low Df interlayer bonding sheet for making multilayer HF PWB |
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■Features |
- Dk=3.01 / Df=0.0019 @80GHz.
- Excellent in circuit embedability even with thickness of 25μm.
- Suitable as interlayer bonding sheet for making multilayer High Frequency PWB without spoiling dielectric properties.
- Multilayer processing could be performed with rather low temperature of 180℃
- Suitable for countermeasure to skew as not containing glass fabric.
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■Applications |
- Interlayer bonding sheet for making multilayer High Frequency PWB
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■Composition |
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■Dielectric properties according to temperature |
＜Dielectric constant＞ |
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＜Dissipation factor＞ |
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℃ |
Frequency (GHz) |
| 10 |
20 |
30 |
40 |
50 |
60 |
70 |
80 |
90 |
100 |
110 |
120 |
| Dk |
125 |
3.02 |
3.01 |
3.01 |
3.00 |
3.00 |
3.00 |
3.00 |
3.00 |
3.00 |
3.00 |
3.01 |
3.01 |
| 100 |
3.03 |
3.02 |
3.02 |
3.01 |
3.01 |
3.01 |
3.01 |
3.01 |
3.01 |
3.01 |
3.02 |
3.02 |
| 60 |
3.04 |
3.04 |
3.03 |
3.03 |
3.02 |
3.02 |
3.02 |
3.02 |
3.02 |
3.03 |
3.03 |
3.04 |
| 20 |
3.05 |
3.05 |
3.04 |
3.04 |
3.04 |
3.03 |
3.03 |
3.03 |
3.04 |
3.04 |
3.04 |
3.05 |
| -20 |
3.06 |
3.06 |
3.05 |
3.05 |
3.05 |
3.05 |
3.05 |
3.05 |
3.05 |
3.05 |
3.06 |
3.06 |
| -60 |
3.07 |
3.07 |
3.06 |
3.06 |
3.06 |
3.06 |
3.06 |
3.06 |
3.06 |
3.06 |
3.07 |
3.07 |
| Df |
125 |
0.0017 |
0.0018 |
0.0019 |
0.0020 |
0.0021 |
0.0022 |
0.0023 |
0.0023 |
0.0024 |
0.0024 |
0.0025 |
0.0025 |
| 100 |
0.0016 |
0.0017 |
0.0019 |
0.0020 |
0.0021 |
0.0022 |
0.0022 |
0.0023 |
0.0023 |
0.0023 |
0.0024 |
0.0023 |
| 60 |
0.0015 |
0.0016 |
0.0017 |
0.0018 |
0.0018 |
0.0019 |
0.0020 |
0.0020 |
0.0021 |
0.0021 |
0.0021 |
0.0021 |
| 20 |
0.0013 |
0.0014 |
0.0015 |
0.0016 |
0.0016 |
0.0017 |
0.0017 |
0.0018 |
0.0018 |
0.0018 |
0.0019 |
0.0019 |
| -20 |
0.0012 |
0.0012 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0015 |
0.0016 |
0.0016 |
0.0017 |
0.0017 |
0.0017 |
| -60 |
0.0010 |
0.0010 |
0.0011 |
0.0012 |
0.0012 |
0.0013 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0015 |
0.0016 |
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| Test results show that AD-3379H keeps both Low Dk and Low Df property under atomosphere of between -60℃ and 125℃ at from 10GHz to 120 GHz. |
■General properties |
| Test item |
Unit |
Treatment |
AD-3379H |
| Dielectric constant |
10GHz |
－ |
C-24/25/50 |
3.03 |
| 30GHz |
3.02 |
| 60GHz |
3.01 |
| 80GHz |
3.01 |
| 100GHz |
3.01 |
| Dissipation factor |
10GHz |
－ |
C-24/25/50 |
0.0016 |
| 30GHz |
0.0018 |
| 60GHz |
0.0019 |
| 80GHｚ |
0.0019 |
| 100GHz |
0.0020 |
| Glass transition temp. |
DMA |
℃ |
Ａ |
225 |
| Coefficient of Thermal Expansion |
α1(X,Y,Z) |
ppm/℃ |
A |
40 – 50 |
| Water absorption |
% |
E-24/50
+D-24/23 |
0.1 |
| Young's modulus |
GPa |
A |
0.6 |
| Poisson's ratio |
- |
A |
0.35 |
| Insulation resistance |
RT |
MΩ |
C-96/20/65 |
2×108 |
| After boiling treatment |
C-96/20/65
+D-2/100 |
8×107 |
| Volume resistivity |
RT |
MΩm |
C-96/20/65 |
1×109 |
| After hygroscopic treatment |
C-96/20/65
+C-96/40/90 |
3×108 |
| Surface resistance |
RT |
MΩ |
C-96/20/65 |
1×1010 |
| After treatment |
C-96/20/65
+C-96/40/90 |
4×109 |
| Solder limit |
300℃ Float |
sec |
Ａ
（Cu clad） |
300
OK |
| Peel strength |
18mm - HVLP |
kN/m |
A |
0.6 |
| UL flammability |
－ |
UL94 |
V-0
equiv. |
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The above figures are not guaranteed value but one of test results at our laboratory. |
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