HOME > Products > Electronic material > High performance CCL > CS-3387S

Halogen-free
Low dielectric Epoxy |
Dk=3.9@1GHz
Df=0.0075@1GHz
CS-3387S

|
Product code |
Double sided
(Representative) |
CS-3387S |
Single sided |
CS-3382S |
Multilayer |
CS-4387S |
Prepreg |
ES-3308S |
|
Features
- Halogen-free,Antimony-free,Red phosphorous-free.
- UL/94V-0.
- Low CTE of Z(α1)=40ppm/℃.
- Excellent in Plated Through Hole (PTH) reliability.
- Tg = 180℃ (DMA).
- Excellent in Price Performance.
|
Applications
- High frequency substrate.
- Mobile base station (Antenna,Power amplifier)
- ATM equipment
- Router
- Automotive (ETC related equipment)
|
Signal transmission speed |
 |
Signal transmission loss |
 |
VLP (Very Low Profile) Cu clad type with less transmission loss is also available. |
General properties |
Test items |
Unit |
treatment |
CS-3387S |
Halogen free compliance |
- |
- |
OK |
Grade |
ANSI |
- |
- |
FR-4 equiv. |
JIS |
- |
- |
GE4F |
Insulation resistance |
at RT |
MΩ |
C-96/20/65 |
6×108 |
After treatment |
+D-2/100 |
7×107 |
Volume resistivity |
at RT |
MΩm |
C-96/20/65 |
3×107 |
After treatment |
+C-96/40/90 |
2×106 |
Surface resistance |
at RT |
MΩ |
C-96/20/65 |
1×108 |
After treatment |
+C-96/40/90 |
5×107 |
Dielectric constant
(1GHz) |
at RT |
- |
A |
3.9 |
Dissipatin factor
(1GHz) |
at RT |
- |
A |
0.008 |
Flexural strength |
Warp |
MPa |
A |
560 |
Fill |
450 |
Solder limit
(Float) |
260℃ |
sec. |
A |
300< |
Peel strength |
18μm |
kN/m |
A |
1.3 |
Water absorption |
% |
E-24/50
+D-24/23 |
0.07 |
UL Flammability
|
- |
A |
94V-0 |
Tg |
TMA |
℃ |
A |
155 |
DMA |
180 |
CTE
(Z-axis) |
α1 |
ppm/℃ |
A |
40 |
α2 |
220 |
*Above figures show the test result of 1.6mm or 0.8mm thickness material at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications
Substrate thickness (mm) |
0.06 / 0.1/ 0.15 / 0.2 / 0.3 / 0.4 / 0.5 / 0.6 / 0.8/ 1.0 / 1.2 / 1.6 / 2.0 / 2.4 |
Cu thickness (μm) |
12 / 18 / 35 / 70 |
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