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HOME > Products > Electronic material > High performance Copper > CS-3396

Electronic material

CS-3396

RISHOLITE

 

High Dk PPE

 

Dk=11.3@1GHz

CS-3396

 

CS-3396

 

Product code
Double sided
(Representative)
CS-3396
Single sided -
Multilayer -
Prepreg ES-3346
Core -

 

■Features

  • Dk=11.3 / Df=0.0028 @1GHz.
  • Excellent in handleability with flexural modulus of 14GPa
  • Excellent in thermal conductivity of 1W/mK.
  • Available for mulytilayer processing.
  •  

    ■Applications

  • Downsizing of HF substrate (Antenna,Sensor and so on).
  • Device embedded substrate.
  •  

    ■Dielectric properties according to temperature (7GHz)

    CS-3396 keeps excellent dielectric properties under atomosphere from -40℃ to 80℃.

     

    ■Dielectric properties according to humidity (7GHz)

    Test condition:60℃/90%
    CS-3396 keeps excellent dielectric properties under atomosphere of high humidity.
     

    ■Dielectric properties according to frequency

     

    <Dielectric constant>

     

    <Dissipation factor>

    CS-3396 keeps excellent dielectric properties under frequency from 5GHz to 65GHz.

    General properties

    Test items

    Unit

    Treatment

    CS-3396

    Insulation resistance

    Normal condition

    C-96/20/65

    5.0×108

    After treatment +D-2/100 1.2×107

    Volume resistivity

    Normal condition

    MΩm

    C-96/20/65

    4.1×107

    After treatment +C-96/40/90 1.3×107

    Surface resistance

    Normal condition

    C-96/20/65

    1.7×109

    After treatment +C-96/40/90 2.0×108

    Dielectric constant

    RF I-V method

    A

    11.3

    (1GHz)

    Stripline method

    9.5

    (1GHz)

    Balanced-type circular disk resonator

    10.2

    (7GHz)

    Cavity resonator

    13.2

    (7GHz)

    Dissipation factor

    RF I-V method

    A

    0.0028

    (1GHz)

    Stripline method

    0.003

    (1GHz)

    Balanced-type circular disk resonator

    0.005

    (7GHz)

    Cavity resonator

    0.005

    (7GHz)

    Solder limit

    288℃

    sec

    288℃

    300<

    Peel strength

    Cu 35μm

    kN/m

    A

    1.0

    Flexural strength

    Warp / Fill

    MPa

    330/290

    Flexural modulus

    Warp / Fill

    GPa

    A

    14/14

    Water absorption

    %

    23℃/24Hr

    0.02

    (1.6mm)

    Specific gravity

    g/cm3

    2.8

    Thermal conductivity

    (Laser flash method)

    W/mK

    A

    1.0

    CTE(α1)

    Warp / fill / Thickness

    ppm/℃

    A

    15/15/55

    CTE(α2) Thickness 230

    Tg

    DMA

    180

    UL flammability

    UL94

    94V-1

    *Test method is JIS C 6481(Test piece thickness=1.6mm)
    *The various above-mentioned data is measured value , and is not guarnteed ferformance.

     

    ■Standard specifications

    Substrate thickness (mm)

    0.14 / 0.28 / 0.42 / 0.56 / 0.84 / 1.12 / 1.54

    Cu thickness (μm) 18 / 35

    CCL with customized thickness is also negotiable.

     

    Sister products

    ES-3346

    CD-3396

    AD-3396

    CC-3396

    ▲Prepreg/ES-3346

    ▲Resin Coated Copper

    /CD-3396

    ▲Bonding sheet/AD-3396

    ▲Nonreinforced CCL

    /CC-3396