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High Dk PPE |
Dk=11.3@1GHz
CS-3396

|
Product code |
Double sided
(Representative) |
CS-3396 |
Single sided |
- |
Multilayer |
- |
Prepreg |
ES-3346 |
Core |
- |
|
■Features |
Dk=11.3 / Df=0.0028 @1GHz.
Excellent in handleability with flexural modulus of 14GPa
Excellent in thermal conductivity of 1W/mK.
Available for mulytilayer processing.
|
■Applications
|
Downsizing of HF substrate (Antenna,Sensor and so on).
Device embedded substrate.
|
■Dielectric properties according to temperature (7GHz) |
 |
CS-3396 keeps excellent dielectric properties under atomosphere from -40℃ to 80℃. |
■Dielectric properties according to humidity (7GHz) |
 |
Test condition:60℃/90% |
CS-3396 keeps excellent dielectric properties under atomosphere of high humidity. |
■Dielectric properties according to frequency |
<Dielectric constant> |
 |
<Dissipation factor> |
 |
CS-3396 keeps excellent dielectric properties under frequency from 5GHz to 65GHz. |
■General properties |
Test items |
Unit |
Treatment |
CS-3396 |
Insulation resistance |
Normal condition |
MΩ |
C-96/20/65 |
5.0×108 |
After treatment |
+D-2/100 |
1.2×107 |
Volume resistivity |
Normal condition |
MΩm |
C-96/20/65 |
4.1×107 |
After treatment |
+C-96/40/90 |
1.3×107 |
Surface resistance |
Normal condition |
MΩ |
C-96/20/65 |
1.7×109 |
After treatment |
+C-96/40/90 |
2.0×108 |
Dielectric constant |
RF I-V method |
- |
A |
11.3
(1GHz) |
Stripline method |
9.5
(1GHz) |
Balanced-type circular disk resonator |
10.2
(7GHz) |
Cavity resonator |
13.2
(7GHz) |
Dissipation factor |
RF I-V method |
- |
A |
0.0028
(1GHz) |
Stripline method |
0.003
(1GHz) |
Balanced-type circular disk resonator |
0.005
(7GHz) |
Cavity resonator |
0.005
(7GHz) |
Solder limit |
288℃ |
sec |
288℃ |
300< |
Peel strength |
Cu 35μm |
kN/m |
A |
1.0 |
Flexural strength |
Warp / Fill |
MPa |
A |
330/290 |
Flexural modulus |
Warp / Fill |
GPa |
A |
14/14 |
Water absorption |
% |
23℃/24Hr |
0.02
(1.6mm) |
Specific gravity |
g/cm3 |
- |
2.8 |
Thermal conductivity
(Laser flash method) |
W/mK |
A |
1.0 |
CTE(α1) |
Warp / fill / Thickness |
ppm/℃ |
A |
15/15/55 |
CTE(α2) |
Thickness |
230 |
Tg |
DMA |
℃ |
A |
180 |
UL flammability |
- |
UL94 |
94V-1 |
|
*Test method is JIS C 6481(Test piece thickness=1.6mm)
*The various above-mentioned data is measured value , and is not guarnteed ferformance. |
■Standard specifications |
Substrate thickness (mm) |
0.14 / 0.28 / 0.42 / 0.56 / 0.84 / 1.12 / 1.54 |
Cu thickness (μm) |
18 / 35 |
CCL with customized thickness is also negotiable. |
Sister products |

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▲Prepreg/ES-3346 |
▲Resin Coated Copper
/CD-3396 |
▲Bonding sheet/AD-3396 |
▲Nonreinforced CCL
/CC-3396 |