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Product code |
Double sided
(Representative) |
CS-3666Z |
Unclad |
- |
Multilayer |
- |
Prepreg |
- |
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Halogen-free High Modulus CCL
for IC Package
CS-3666Z
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Features
- Least warpage at reflow soldering process
- Flexural modulus=26GPa (at 250℃)
- Tg>300 degree C (Z type)
- CTE(ppm/℃) =X:10 / Y:11 / Z:34
- Excellent in drilling workability
- Phosphate free for environment
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Applications
- Package substrates
- Build-up core
- Automotive electronics
- Burn in board
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Flexural modulus
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Warpage
(35 → 275 → 25℃)
Test specimen:CSP/BGA chip (Molded)
Size :1.1×14×18mm
No. of pcs. :10
Heat condition:35℃→275℃→25℃
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Coplanarity
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General properties |
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| Test items |
Unit |
Treatment |
CS-3666Z |
| Halogen free compliance |
- |
- |
○ |
| Grade |
ANSI |
- |
- |
GPY equiv. |
| JIS |
- |
- |
GI2F |
| Insulation resistance |
at RT |
MΩ |
C-96/20/65 |
8×108 |
| After treatment |
+D-2/100 |
8×108 |
| Volume resistivity |
at RT |
MΩm |
C-96/20/65 |
4×107 |
| After treatment |
+C-96/40/90 |
2×107 |
| Surface resistance |
at RT |
MΩ |
C-96/20/65 |
6×109 |
| After treatment |
+C-96/40/90 |
1×109 |
Dielectric constant
(1MHz) |
at RT |
- |
C-96/20/65 |
4.6 |
Dissipasion factor
(1MHz) |
at RT |
- |
C-96/20/65 |
0.010 |
| Flexural strength |
Warp |
MPa |
A |
830 |
| Fill |
770 |
Solder limit
(Float) |
260℃ |
sec. |
A |
300< |
| Peel strength |
18μm |
kN/m |
A |
0.8 |
| Water absorption |
% |
E-24/50
+D-24/23 |
0.22 |
UL Flammability
|
- |
A |
94V-0 equiv. |
| Tg |
TMA |
℃ |
A |
300< |
| DMA |
300< |
| Flexural modulus |
Warp |
GPa |
A |
32 |
| Fill |
32 |
| CTE α1 |
Warp |
ppm/℃ |
A |
10 |
| Fill |
10 |
| Z-axis |
34 |
| CTE α2 |
Z-axis |
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- |
Thermal expansion
(20～260℃) |
Z-axis |
% |
A |
0.80 |
| Thermal conductivity(Probe) |
W/mK |
A |
0.35 |
*Above figures show the test result of 0.8mm material at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications
| Substrate thickness (mm) |
0.06 / 0.1 / 0.15 / 0.21 / 0.4 / 0.6 / 0.7 / 0.8 / 1.0 / 1.2 / 1.4 / 1.6 |
| Cu thickness (μm) |
12 / 18 / 35 |
CCL with customized thickness is also negotiable.
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