HOME > Products > Electronic material > High performance CCL > CS-3666X
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Environmental friendly high Tg CCL
CS-3667
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About icons
| Product code |
Double sided
(Representative) |
CS-3667 |
| Unclad |
ES-3662 |
| Multilayer |
- |
| Prepreg |
ES-3617 |
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Features
- Halogen free,phosphorous and metal hydroxide free.
- Glass transition temperature:215 degree C
- Least warpage
- Good drilling workability(FR-4<)
- High cost performance
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Applications
- IC package substrate
- LED substrate
- Automotives substrate
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General properties |
| Test items |
Unit |
Treatment |
CS-3667 |
| Halogen free compliance |
- |
- |
OK |
| Grade |
ANSI |
- |
- |
FR-5 equiv. |
| JIS |
- |
- |
GE2F |
| Insulation resistance |
at RT |
MΩ |
C-96/20/65 |
3×109 |
| After treatment |
+D-2/100 |
1×108 |
| Volume resistivity |
at RT |
MΩm |
C-96/20/65 |
1×108 |
| After treatment |
+C-96/40/90 |
8×107 |
| Surface resistance |
at RT |
MΩ |
C-96/20/65 |
3×1010 |
| After treatment |
+C-96/40/90 |
4×109 |
Dielectric constant
(1MHz) |
at RT |
- |
C-96/20/65 |
4.9 |
Dissipation factor
(1MHz) |
at RT |
- |
C-96/20/65 |
0.012 |
| Flexural strength |
Warp |
MPa |
A |
570 |
| Fill |
510 |
Solder limit
(Float) |
260℃ |
sec. |
A |
300< |
| Peel strength |
18μm |
kN/m |
A |
0.9 |
| Water absorption |
% |
E-24/50
+D-24/23 |
0.13 |
UL Flammability
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- |
A |
94V-0 equiv. |
| Tg |
TMA |
℃ |
A |
195 |
| DMA |
215 |
| Flexural modulus |
Warp |
GPa |
A |
27 |
| Fill |
25 |
| CTE α1 |
Z-axis |
ppm/℃ |
A |
34 |
| Warp |
13 |
| Fill |
13 |
| CTE α2 |
Z-axis |
ppm/℃ |
A |
120 |
Thermal expansion
(20～260℃) |
Z-axis |
% |
A |
1.54 |
Thermal conductivity
(Laser flash) |
W/mK |
A |
0.6 |
*Above figures show the test result of 0.8mm material at our laboratory
*Test method is JIS C 6481 except UL flammability |
Standard specifications
| Substrate thickness (mm) |
0.06 / 0.1 / 0.2 / 0.25 / 0.3 / 0.4 / 0.5 / 0.6 / 0.7 / 0.8 / 1.0 / 1.2 / 1.6 |
| Cu thickness (μm) |
12 / 18 / 35 |
CCL with customized thickness is also negotiable.
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