HOME > Products > Electronic material > High performance CCL < CS-3945
1.8W/mK / High thermal conductive for LED
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White colored for LEDs |
CS-3945
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▲Adoption image |
Proposal of application of
RISHO thermal solution materials
Click the above picture
for more information |
Low thermal resistance through thin substrate |
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CS-3945 which consists of only Glass fabric can be made into a thin substrate and heat can conduct smoothly through the thinness. |
Spectral reflectivity |
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The above graph shows spectral reflectance on Cu etched surface and shows CS-3945 can reflect every visible light efficientry. |
Discoloration resistance |
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The above shows discoloration on Cu etched surface of test pieces after 120℃ heat treatment.
Least discoloration appeared on CS-3945 even after 2000 hours. |
Reduction of thermal resistance |
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▲Thermal resistant test based on JPCA-TMC-LED02T |
CS-3945 can be made into so thin substrate that it can reduce thermal resistance.
The above graph shows result of thermal resistance test based on "JPCA-TMC-LED02T" |
Long term reliability |
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【Test condition】
Test piece thick = 0.6mm
Treatment = 85℃/85%
Power = 100V
Hole dia.=0.4mm
Hole pitch = 0.3mm
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| CS-3945 has excellent connection reliability even in high humidity environment |
General properties |
| Test items |
Unit |
Treatment |
CS-3945 |
| Halogen free compliance |
- |
- |
OK |
| Insulation resistance |
RT |
MΩ |
C-96/20/65 |
3×108 |
After
treatment |
+D-2/100 |
1×107 |
| Surface resistance |
RT |
MΩ |
C-96/20/65 |
1×109 |
| Volume resistivity |
RT |
MΩm |
C-96/20/65 |
1×107 |
| Tracking resistance |
IEC
method |
- |
A |
600 |
| Dielectric constant |
1MHz |
- |
A |
7.0 |
| Dissipation factor |
- |
A |
0.015 |
| Peel strength |
35μm |
kN/m |
A |
1.1 |
| Solder limit |
260℃ |
sec |
A |
300< |
| Tg |
DMA |
℃ |
A |
140 |
| Water absorption |
％ |
E-24/50
+D-24/23 |
0.09 |
Flexural modulus
(1.6mm thick) |
Warp/Fill |
GPa |
A |
31/39 |
Flexural strength
(1.6mm thick) |
Warp/Fill |
MPa |
A |
450/350 |
| Specific gravity |
|
A |
2.4 |
| Thermal conductivity |
Laser flash method |
W/mK |
A |
1.3 |
| TIM tester method |
1.8 |
CTE |
Warp/Fill |
ppm/℃ |
A |
13/14 |
| Flammability |
UL |
－ |
A |
94V-0 |
| Anti-CAF property |
－ |
C-500/110/85 |
○ |
| Drilling workability |
－ |
－ |
As well as FR-4 |
*The various above-mentioned data is measured value , and is not guaranteed performance.
*Test method is JIS C 6481 except UL flammability
*Test piece thickness=0.4mm
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UL recognized specification (Excerpt) |
ANSI
grade |
Min.
thickness
（mm） |
|
Max.
area
diameter
（mmφ） |
UL94
flame
class |
Solder
limit |
Max.
operating
temp.
(℃) |
|
External layer
|
Internal layer |
Temp.
（℃） |
Time
(sec) |
| Min. |
Max. |
Min. |
|
No ANSI
|
0.1 |
18 |
102 |
－ |
50.8 |
V-0 |
260 |
20 |
90 |
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Standard specifications |
| Substrate thickness (mm) |
0.1 / 0.2 / 0.4 / 0.6 / 0.8 / 1.0 / 1.6 |
| Cu thickness (μm) |
18 / 35 / 70 |
CCL with customized thickness is also negotiable. |
