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AD-7303 / CD-7303/ Solder crack resistant type
Suitable for reducing solder cracks
λ=3W/mK
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Bonding sheet
AD-7303 |
Resin Coated Copper
CD-7303 |
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Material composition |
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▲AD-7303
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▲CD-7303 |
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▲Application image of AD-7303 |
| AD-7303,soft even after thermosetting , could absorb thermal expansion of Aluminum plate which causes solder cracks. |
Specifications |
| ＜Dimensions＞ |
| Product code |
Product dimensions
(mm) |
AD-7303
CD-7303 |
510mm × 510mm
340mm × 510mm
and so on |
|
＜Thickness＞ |
| Product code |
Insulation layer
(μm) |
Copper foil
(μm) |
AD-7303 |
120 |
― |
| CD-7303 |
70 |
|
General properties of insulating layer |
| Test items |
Unit |
Treatment |
7303 |
Remarks |
| Thermal conductivity
（Laser flash method） |
W/mK |
A |
3 |
Results of insulation layer |
Glass transition temperature
（DMA） |
℃ |
A |
177 |
Young's modulus
(RT） |
GPa |
A |
2.4 |
| Poisson's ratio |
- |
A |
0.27 |
| Dielectric constant |
1MHz |
- |
A |
6.16 |
| Dissipation factor |
1MHz |
- |
A |
0.027 |
| Thermal conductivity
（TIM tester method） |
W/mK |
A |
3 |
Results of Aluminum base PWB materioal |
| Peel strength |
35μm |
kN/m |
A |
0.9 |
| 70μm |
kN/m |
A |
1.2 |
| Solder limit |
300℃ |
sec. |
A |
600< |
| Surface resistance |
MΩ |
C-96/20/65 |
6.5×108 |
| Volume resistivity |
MΩ・m |
C-96/20/65 |
1.0×106 |
| UL flammability |
- |
UL94 |
V-0
equiv. |
|
| The various above-mentioned data is measured value, and is not guaranteed performance. |
Breakdown voltage |
 |
The above shows that AD-7303 could withstand voltage up to 6400V on average even if it is soft and very thin. |
Test method:JIS C 2110
Step up voltage at a rate of 500V a second up to breakdown.
Test piece size (Thickness)
Aluminum plate=1.5mm, Insulation layer=120μm, Cu foil=35μm
Test condition
Negative electrode=Alumimun plate Positive electrode=Cu foil(25mmφ)
Impressed current =AC Leakage current=3mA
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Long term reliability |
<Breakdown voltage> |
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Test results show that AD-7303 has insulation strength of at least 5kV under such conditions as follows.
- For 3000 hours under 175℃
- For 3000 hours under both Temperature of 85℃ and Humidity of 85%
- For 3000-time thermal cycles between -55℃(30min) and 125℃(30 min).
|
<Peel strength> |
 |
Test results show that AD-7303 has peel strength of at least more than 0.5kN/m under such conditions as follows.
- For 3000 hours under175℃
- For 3000 hours under both Temperature of 85℃ and Humidity of 85%
- For 3000-time thermal cycles between -55℃(30min) and 125℃(30 min).
|
Migration resistance |
 |
Atomosphere = Temperature:85℃ / Humidity:85%
Applied voltage = DC 100V (Vertical to layers)
Positive = Cu
Negative = Al |
| Test results show that AD-7303 is excellent in connection reliability even in high humidity atomoshere. |
