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Electronic material > High thermal conductive bonding sheet > AD-7210N
λ=8W/mK
Proposal for alternative to ceramic substrate |
AD-7210N
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Material composition |
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Specifications |
| ＜Dimensions＞ |
| Product code |
Dimensions (mm) |
AD-7210N |
510mm × 510mm
340mm × 510mm
and so on |
|
＜Thickness＞ |
| Product code |
Insulation layer
(μm) |
AD-7210N |
120 |
|
General properties of insulating layer
| Test items |
Unit |
AD-7210N |
Remarks |
Thermal conductivity
(Laser flash method) |
W/m･K |
10 |
Test results of insulation layer |
Glass transition temperature
(DMA) |
℃ |
300< |
Coefficient of thermal expansion
(Z-direction) |
α1 |
ppm/℃ |
10～30 |
| α2 |
40～80 |
| UL flammability |
－ |
94V-0
equiv. |
Thermal conductivity
(TIM tester method) |
W/m･K |
8 |
Test results of Aluminum base PWB material |
| Breakdown voltage |
kV |
5.0 |
Solder limit
(280℃ float) |
sec |
300< |
Peel strength
(Cu:35µm) |
kN/m |
1.2 |
|
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| The various above-mentioned data is measured value, and is not guaranteed performance. |
Breakdown voltage |
| The below shows the test result of AC-7210N which AD-7210N is coated as insulation layer on Aluminum plate's surface. |
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AD-7210N could withstand 5000V on average even if it is very thin of 0.12mm. |
Hot breakdown voltage |
| The below shows test results of AC-7210N about breakdown voltage at 20℃(RT),100℃,150℃ and 200℃. |
 |
| AD-7210N can withstand voltage of 5000V even under hot temperature as shown the above. |
Peel strength after long term heat treatment |
| The below shows test results of AC-7210N about peel strength of copper circuit after heat treatment of 175℃ and 200℃ for 3000 hours. |
 |
| Peel strength hardly decreased even after 3000-hour of heat treatment at 175℃ or 200℃ |
RISHO's proposal |
| We propose that substrate for mounting power LEDs could be made with AD-7210N without using ceramic substrate. |
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▲Image of power LED substrate made of ceramic
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▲Image of power LED substrate made with AD-7210N
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