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Low resin flow Bonding sheet
White colored bonding sheet which has low resin flow property at applying process.
Suitable for constructional material of LED substrate.
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Line ups |
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▲AD-7006W (Left / White type)
AD-7006(Right / Clear type) |
▲AD-7006B (Black type) with infrared shielding property. |
| Click the above photos to get more information |
High thermal conductive type is also available |
Features |
- Low resin flow at applying process.
- Excellent in handleability at applying process.
- Excellent in Bonding strength.
- Black type is excelent in light shielding property not only at visible range but also at far-red range even if it is thin.
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Propoasal of application of RISHO thermal solution materials
Click the above picture for more information
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Composition
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Standard specification
(Thickness of insulating layer)
AD-7006W : 40μm
AD-7006 : 40μm |
| General properties of insulating layer |
| Test item |
Unit |
Treatment |
AD-7006W
AD-7006 |
| Thickness |
μm |
－ |
40 |
| Halogen free compliance |
－ |
－ |
◯ |
| Peel strength |
kN/m |
18μm |
1.8 |
| Solder limit |
sec |
260℃
Float |
300< |
| Volume resistivity |
MΩm |
C-96/20/65 |
9.5×107 |
| Surface resistance |
MΩ |
C-96/20/65 |
1.0×109 |
| Dielectric constant (1MHz) |
－ |
C-96/20/65 |
2.8 |
| Dissipation factor (1MHz) |
－ |
C-96/20/65 |
0.031
(1.0mm thick.) |
| Glass transition temperature(TMA) |
℃ |
Ａ |
124 |
| Coeficient of thermal expansion |
ppm/℃ |
α1 |
48 |
| α2 |
358 |
| Water absorption |
% |
E-24/50
+D24/23 |
1.9 |
| Poisson's ratio |
－ |
Ａ |
0.42 |
Thermal conductivity
（Hot wire method） |
W/mK |
A |
0.3 |
| Low resin flow property |
－ |
－ |
◯ |
| Handleability |
－ |
－ |
◎ |
| Anti-discoloration property |
－ |
－ |
△ |
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| The various above-mentioned data is measured value, and is not guaranteed performance. |
