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CCLs for IC package substrate
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CCLs for IC package substrates with excellent hot flexural modulus and Less warpage at reflow soldering.
Also suitable for substrates required of high reliability such as Automotive applications. |
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| Product code |
Properties |
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Halogen free & Metal hydroxide free.
Tg>300 degree C.
Excellent in hot flexural modulus of 19GPa at 250 degree C.
Excellent in Laser workability.
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CTE=6ppm/℃(XY) despite consisting of E-glass.
Excellent in Price/Performance
Low water absorption. |
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(Natural color) |
Halogen free & Metal hydroxide free.
Suitable for substrate of single function ICs |
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(Black) |
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| General properties |
| Test items |
unit |
Treatment |
CS-3667 |
CS-3305A |
CS-3305 |
CS-3356S |
| Halogen free compliance |
- |
- |
○ |
○ |
○ |
○ |
| Insulation resistance |
R.T. |
MΩ |
C-96/20/65 |
3×109 |
3×109 |
4×109 |
9×108 |
| After treatment |
+D-2/100 |
1×108 |
1×108 |
2×108 |
5×107 |
| Volume resistivity |
R.T. |
MΩ-m |
C-96/20/65 |
1×108 |
1×108 |
1×107 |
5×107 |
| After treatment |
+C-96/40/90 |
8×107 |
8×107 |
7×107 |
1×106 |
| Surface resistance |
R.T. |
MΩ |
C-96/20/65 |
3×1010 |
8×109 |
1×109 |
1×108 |
| After treatment |
+C-96/40/90 |
4×109 |
4×107 |
1×107 |
5×107 |
| Dielectric constant(1MHz) |
R.T. |
- |
C-96/20/65 |
4.9 |
4.1 |
3.9 |
4.4 |
| Dissipation factor(1MHz) |
R.T. |
- |
C-96/20/65 |
0.012 |
0.010 |
0.007 |
0.012 |
| Flexural strength |
Warp |
MPa |
A |
570 |
520 |
566 |
610 |
| Fill |
510 |
510 |
558 |
450 |
| Solder limit (Float) |
260℃ |
sec |
A |
300< |
300< |
300< |
300< |
| Peel strength |
18μm |
kN/m |
A |
0.9 |
0.8
(12μm) |
0.8
(12μm) |
1.5 |
| Water absorption |
% |
E-24/50
+D-24/23 |
0.13 |
0.13 |
0.13 |
0.09 |
| UL flammability |
- |
A |
94-V0 equiv. |
94-V0 equiv. |
94-V0 equiv. |
94-V0 |
| Glass transition temprtature |
DMA |
℃ |
A |
215 |
300< |
300< |
180 |
| Flexural modulus |
Warp |
GPa |
A |
27 |
35 |
34 |
31 |
| Fill |
25 |
33 |
33 |
28 |
| Hot flexural modulus |
Warp |
GPa |
260℃ |
- |
19 |
19 |
13 |
| Fill |
- |
19 |
19 |
10 |
| Coefficient of thermal expansion(α1) |
Thickness |
ppm/℃ |
A |
34 |
13 |
24 |
27 |
| Warp |
13 |
6
(0.1mm) |
12 |
12 |
| Fill |
13 |
6
(0.1mm) |
12 |
13 |
| Coefficient of thermal expansion(α2) |
Thickness |
120 |
- |
53 |
160 |
| Thermal expansion(20～260℃) |
Thickness |
% |
A |
1.54 |
0.6 |
0.92 |
2.3 |
| Thermal conductivity(Laser flash) |
W/mK |
A |
0.6 |
0.5 |
0.6 |
0.7 |
*Above figures show the test result of 0.8mm thickness material at our laboratory
*Test method is JIS C 6481 except UL flammability |
